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  4. 吳美玲

◎ 研討會論文(M.L. Wu)

arow.gif (1479 bytes)  研討會論文：

 
 Conference Proceedings (August, 2007 ~)
 
1.      Jia-Shen Lan, and Mei-Ling Wu* (2012), “Stress Analysis of Multilayered Printed Circuit Board under Mechanical Loading,” Accepted to Pan Pacific Microelectronics Symposium, Failure Modeling and Design, Fab. 15
 
2.    Yung-Wen Wang, and Mei-Ling Wu* (2012), “Critical Parameter Selection for Solder Joints of Microelectronic Products under Thermal Cycling”, Accepted to Pan Pacific Symposium, Failure Modeling and Design, Fab. 15
 
3.    Jan-Long Yang, and Mei-Ling Wu* (2012), “An Analysis of Failure of Microelectronic Packaging Due to Conductive Anodic Filament Formation”, Accepted to Pan Pacific Symposium, Failure Modeling and Design, Fab. 15
 
4.    Mei-Ling Wu* (2011), “Global Sensitivity Analysis of Solder Joint Fatigue Life Model,” Proceedings of the ASME 2011 International Mechanical Engineering Congress & Exposition, Nov. 11-17, 2011, Denver, Colorado, USA
 
5.     Liang-Yu Wu, Tzeh-Yi Chiang, Mei-Ling Wu, and Lien-Wen Chena* (2011), “An acoustic metamaterial bending waveguide design using transformation acoustics,” Proceedings of the ASME 2011 International Mechanical Engineering Congress & Exposition, Nov. 11-17, 2011, Denver, Colorado, USA (Speaker: Mei-Ling Wu)
 
6.    Jan-Long Yang and Mei-Ling Wu* (2011), “Models for physics of Failures Analysis during Printed Wiring Board Bending”, International Microsystems, Packaging Assembly and Circuit Technology Conference, NTUH International Convention Center, Taipei, Taiwan (Accepted Papers Will Be Collected in IEEE Xplore)
 
7.     Yung-Wen Wang, and Mei-Ling Wu* (2011), “Failure of Lead-Free Solder Joint under Thermal Cycling”, International Microsystems, Packaging Assembly and Circuit Technology Conference, NTUH International Convention Center, Taipei, Taiwan (Accepted Papers Will Be Collected in IEEE Xplore)
 
8.    Ching-Yuan Kao, and Mei-Ling Wu* (2011), “Global Uncertainty Analysis of Solder Joint Fatigue Life Model in Random Vibration Environment”, International Microsystems, Packaging Assembly and Circuit Technology Conference, NTUH International Convention Center, Taipei, Taiwan (Accepted Papers Will Be Collected in IEEE Xplore)
 
9.     Mei-Ling Wu,* Assessing the Impact of Uncertainty in Physics of Failure Analysis of BGA solder joints Fatigue Damage,” Proceedings of the 5th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), and SIPO International 3D IC Conference, October 20-22, 2010, Taipei, Taiwan (Accepted Papers Will Be Collected in IEEE Xplore)
 
10.    Mei-Ling Wu*, Michael Pecht, "Semiconductor Component Qualification”, Proceedings of the 4th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), and SIPO International 3D IC Conference, October 19-23, 2009, Taipei, Taiwan (Accepted Papers Will Be Collected in IEEE Xplore)
 
11.    Mei-Ling Wu*, “Fatigue Life Estimation of BGA Packaging under Vibration and Bending Loads” Materials for Advanced Metallization Conference 2009 (MAM2009), March 8-11, 2009, Minatec, Grenoble, France. (All accepted contributions to the conference will be published as a special issue of Microelectronic Engineering.)
 
12.    Mei-Ling Wu*, “Vibration Failure Assessment Methodology for the Fatigue Life of Ball Grid Array BGA Solder Joints”, Proceedings of the 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference and the 10th International Conference on Electronics Materials and Packaging (EMAP), October 22-24, 2008, Taipei, Taiwan.
 
13.    Mei-Ling Wu*, “Vibration Assessment Methodology of Ball Grid Array (BGA) Solder Joints Fatigue Life”, SMTA International Conference (SMTAI ’08), Orlando, Aug. 17-21, 2008
 
14.    Mei-Ling Wu*, Rapid Assessment of BGA Fatigue Life under Vibration Loading,第二屆海峽兩岸實驗力學研討會, Oct.27, 2007 (NCKU, Tainan)
 
15.    Donald Barker, Patrice Gregory, Jamie Wadkins, and Mei-Ling Wu, “Electronic Component Failure Categorization under Gun Launched High G Loading” UNLV seminar March 6, 2006
 
16.    Donald Barker, Jamie Wadkins, Patrice Gregory, and Mei-ling Wu “Assessing Shock and Vibration Loading on Electronic Assembles” CALCE web-cast seminar 9/21/05.
 
17.    Jamie Wadkins, Patrice Gregory, Mei-Ling Wu, and Donald Barker, “Electronic Component Failure Categorization under Gun Launched High G Loading” Proceedings of the IMECE 2004, 2004 ASME International Mechanical Engineering Congress and Exposition (IMECE), Anaheim, CA., November 14-19, 2004
 
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