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  4. 吳美玲

◎ 期刊論文(M.L. Wu)

arow.gif (1479 bytes)  期刊論文：

      Refereed Journals: 2008~

                http://www.researcherid.com/rid/E-9222-2010 

1.         Mei-Ling Wu*(2010), “Microelectronic Packaging Reliability Using the Response Surface Technique,” Soldering & Surface Mount Technology, Vol. 22, No. 2, pp. 3-12
[NSC-97-2221-E-006-033, SCI, EI]
 
2.         Mei-Ling Wu*(2010), “Design of Experiments to Investigate Reliability for Solder Joints PBGA Package under High Cycle Fatigue,” Microelectronics Reliability, Volume 50, Issue 1, pp. 127–139
[NSC-97-2221-E-006-033, SCI, EI]
 
3.         Mei-Ling Wu*, (2010), Donald Barker, “Rapid Assessment of BGA Life under Vibration and Bending, and Influence of Input Parameter Uncertainties,” Microelectronics Reliability, Volume 50, Issue 1, pp. 140–148 [SCI, EI]
 
4.         Mei-Ling Wu*, Donald Barker, (2010) “Rapid Assessment of BGA Fatigue Life under Vibration Loading,” IEEE Transactions on Advanced Packaging, Vol. 33, No. 1, pp. 88-96 [SCI, EI]
 
5.         Hung-Wen Wang, Mei-Ling Wu, Lien-Wen Chen, (2010) “Focusing analysis of a complex photonic crystal slab with negative refraction,” Physica B: Condensed Matter, Vol. 405, No.19, pp. 4157-4162 [SCI, EI]
 
6.         Mei-Ling Wu*(2009), “Vibration Induced Fatigue Life Estimation of Ball Grid Array Packaging,” Journal of Micromechanics and Microengineering, Vol.19, pp.065005 [NSC-96-2218-E-006-292, SCI, EI]
 
7.         Mei-Ling Wu*(2008), “Fundamental Understanding of BGA Packaging Subjected to Vibration Loads,” Journal of the Chinese Society of Mechanical Engineers, Vol.29, No.6, pp.507~516  [NSC 96-2218-E-006-292, SCI, EI]
 
8.         Mei-Ling Wu, Liang-Yu Wu, Wen-Pei Yang, Lien-Wen Chen, (2009) “Elastic wave band gaps of one-dimensional phononic crystals with functionally graded materials”, Smart Materials & Structures, Vol. 18, pp. 115013 [SCI, EI]
 
9.         Liang-Yu Wu, Mei-Ling Wu, Lien-Wen Chen, (2008)“The narrow pass band filter of tunable 1-D phononic crystals with a dielectric elastomer layer”, Smart Materials & Structures, Vol. 18, No. 1, pp. 015011 [SCI, EI]
 
10.    Liang-Yu Wu, Lien-Wen Chen, Mei-Ling Wu, (2008)“The nondiffractive wave propagation in the sonic crystal consisting of rectangular rods with a slit,” Journal of Physics-Condensed Matter, Vol. 20, No. 29, pp. 295-229 [SCI, EI]
 
***Required Reviews Completed and under Review
 
1.     Mei-Ling Wu*(2011), “Assessing the Impact of Uncertainty for Microelectronic Packaging Fatigue Life in Physics of Failure Analysis,” Submitted to Journal of Micromechanics and Microengineering, [SCI, EI]
 
2.     Mei-Ling Wu*(2011), “Monte Carlo Reliability Simulation of Ball Grid Array Packaging Subject to Dynamics,” Submitted to Computer Modeling in Engineering & Sciences, [SCI, EI]
 
3.     Mei-Ling Wu*(2011), “Global Sensitivity Analysis of BGA Fatigue Life Model: Part I: Application and Physical Insight Using Reliability Analysis”, Submitted to IEEE Transactions on Advanced Packaging, [SCI, EI]
 
4.     Mei-Ling Wu*(2011), “Local Sensitivity Analysis of BGA Fatigue Life Model: Part II: Application and Physical Insight Using Reliability Analysis”, Submitted to IEEE Transactions on Advanced Packaging, [SCI, EI]
 
5.     Mei-Ling Wu*(2011), “Predicting Electronic Component Failure during Circuit Board Bending Events”, Submitted to IEEE Transactions on Components and Packaging Technologies, [SCI, EI]
 
6.     Mei-Ling Wu*(2011), “Probabilistic Simulation for Reliability Analysis of Electronic Packaging”, Submitted to IEEE Transactions on Electronics Packaging Manufacturing, [SCI, EI]
 
7.     Mei-Ling Wu*(2011), “Damage Mechanics of Microelectronics Solder Joints under Dynamics Response to PCB”, Submitted to International Journal of Damage Mechanics, [SCI, EI]
 
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