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◎ 期刊論文(Y.T. Su)

arow.gif (1479 bytes)  期刊論文：

期刊論文(Refereed Journal Papers)

 

    1. Su, Y. T. (1988), "Nonlinear dynamic system identification via nonlinear time series model," J. of CSME, Vol. 9, No. 5, pp. 353-359.

    2. Lin, S. J., Su, Y. T., and Lee, M. S. (1991), "On monitoring of tapered roller bearing with initial fault: resonance demodulation analysis," J. of CSME, Vol.12, No.4, pp. 391-400 (EI) (NSC-77-0401-E110-10).

    3. Su, Y. T. and Lin, S. J. (1992), "On initial fault detection of tapered roller bearing: frequency domain analysis," Journal of Sound and Vibration Vol. 155, No.1, pp. 75-84 (EI, SCI) (NSC-77-0401-E110-10).

    4. Su, Y. T. and Sheen, Y. T. (1992), "A neural network for system identification," International Journal of Systems Science, Vol. 23, No. 12, pp.2171-2186 (EI, SCI) (NSC-81-0422-E110-02).

    5. Su, Y. T., Sheen, Y. T. and Lin, M. H. (1992), "Signature analysis of roller bearing vibrations: lubrication effects," Proc Instn Mech Engrs, Part C: Journal of Mechanical Engineering Science, Vol. 206, pp. 193-202 (EI, SCI) (NSC-79- 0401-E110-07).

    6. Su, Y. T., Lin, M. H. and Lee, M. S. (1993), "The effects of surface irregularities o­n roller bearing vibrations," J. of Sound and Vibration Vol. 163, No. 3, pp.455-466 (EI, SCI) (NSC-79-0401-E110-07).

    7. Su, Y. T. and Sheen, Y. T. (1993), "On the detectability of roller bearing damage by frequency analysis," Proc Instn Mech Engrs, Part C: Journal of Mechanical Engineering Science, Vol. 207, pp. 23-32 (EI, SCI) (NSC-79-0401-E110-07).

    8. Su, Y T., Wang, S. Y., Chao, P. Y., Hwang Y. D.and Hsiau, J. S.(1995), "Investigation of elastic emission machining process: lubrication effect," Precision Engineering, 1995, Vol. 17, No. 3, pp. 164-172 (EI, SCI) (NSC-82- 0422-E110-104).

    9. Su, Y. T., Wang, S. Y. and Hsiau, J. S. (1995), "On machining rate of hydrodynamic polishing process," Wear, 188, pp. 77-87 (EI, SCI) (NSC-82- 0422-E-110-104).

    10. Su, Y. T., Horng, C. C., Wang, S. Y. and Jang, S. H. (1996), "Ultra-precision machining by the hydrodynamic polishing process," Int. Mach. Tools Manufact., Vol. 36, No. 2, pp. 275-291 (EI, SCI) (NSC-83-0401-E-110-003).

    11. Su, Y. T., Horng, C. C., Sheen, J. Y. and Hsiau, J. S. (1996), "A Process planning strategy for removing non-axially symmetric form error by hydrodynamic polishing process," Int. Mach. Tools Manufact., Vol. 36, No. 2, pp. 1227-1245. (EI, SCI) (NSC-83-0401-E-110-003).

    12. Su, Y. T., Horng, C. C. and Kuo, H. K. (1996), "Effect of tool surface irregularities o­n machining rate of hydrodynamic polishing process," Wear, Vol. 199, pp. 89-99 (EI, SCI) (NSC-85-2612-E-110-023).

    13. Wang, S. Y. and Su, Y. T. (1997), "An investigation of machinability of different materials by hydrodynamic polishing process," Wear, Vol. 211, pp. 185-191 (EI, SCI) (NSC-85-2612-E-110-023).

    14. Su, Y. T. and Sheen, J. Y. (1998), "A process planning strategy for removing arbitrary and axially symmetric profile by polishing process, Int. Mach. Tools Manufact., in press (EI, SCI) (NSC-85-2612-E-110-023).

    15. Su, Y. T., Hung, T. C., and Chang, Y. Y. (1998), "On machining rate of hydrodynamic polishing process under semi-contact lubricating condition," Wear, in press (EI, SCI) (NSC-85-2612-E-110-023).

    16. Su, Y. T., Kao, Y. C. (1999), "An experimental study o­n machining rate distribution for hydrodynamic polishing process," Wear, 224, 95-105 (EI, SCI) (NSC-86-2212-E-110-013).

    17. Su, Y. T. (2000), “Investigation of Removal Rate Properties of a Floating Polishing Process,” J. Electrochem. Soc., 147(6), 2290-2296 (EI, SCI) (NSC-88-2212-E-110-023).

    18. Su, Y. T., Hung, T. C and Horng, C. C. (2000), “An experimental study o­n tool wear of hydrodynamic polishing process,” Wear, 246, 117-129 (EI, SCI) (NSC-89-2212-E-110-009).

    19. Su, Y. T., Liu, S. H. and Chen, Y. W. (2001), “A preliminary study o­n smoothing efficiency of surface irregularities by hydrodynamic polishing process,” Wear, 249, 808-202 (EI, SCI) (NSC 89-2218-E110-007).

    20. Hocheng, H, Tsai, H. Y. and Su, Y. T. (2001), “Modeling and experimental analysis of the material removal rate in the chemical mechanical planarization of dielectric films and bare silicon wafers,” J. Electrochem. Soc., 148(10), G581-G586 (EI, SCI)

    21. Su, Y. T., Hung, T. C. and Tsai, C. M. (2003), “On material removal capability of abrasive particle in polishing process,” (invited paper), Int. J. of Mater. and Prod. Tech, 18(4/5/6), 431-456 (EI) (NSC-90-2212-E110-027)

    22. Su, Y. T., Hung, T. C. and Weng, G. C. (2003), “Ultra-precision machining by cylindrical polishing process,” Int. J. Mach. Tools Manufact., 43, 1197-1207 (EI, SCI) (NSC-90-2212-E110-032).

    23. Hung, T. C., Ou, C. C. and Su, Y. T., (2005), “Effect of electric field applied to work surface o­n wear rates at tool and work,”砥粒加工學會誌，49(2), 59-62.

    24. Su, Y. T., Hung, T. C., and Ou, C. C. (2005), “A preliminary analysis o­n tool wear rate of polishing process: adhesion effect,”Wear, 260, 50-61. (EI, SCI) (NSC-91-2212-E110-017)

    25. Hung, T. C. and Su, Y. T. (2005), “Amethod for reducing tool wear in a polishing process,”Int. J. Mach. Tools Manufact. (in press) (EI, SCI)(NSC-91-2212-E110-005)

 

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