PUBLICATIONS:  Conference Papers

1.        Giedt, W. H., and Wei, P. S., 1982, "Temperature and Velocity Distributions in the Liquid Flowing Around the Front of an Electron Beam Welding Cavity," Proceedings ofthe 7th International Heat Transfer Conference , editors: Grigull, U. et al., Hemisphere Publishing Corp., Washington, DC, Vol. 6, pp. 403-407.

2.        Giedt, W. H., and Wei, P. S., 1984,"Fluid Flow in the Liquid Layer around an Electron Beam Welding Cavity," Modeling of Casting and Welding Processes, 1983 Engineering Foundation Conferences,  (edited by Dantzig, J. A., and Berry, J. T.), New England College, Henniker, New Hampshire, July 31-August 5, 1983, AIME, New York, Vol.2, pp.342-348.

3.        Wei, P. S., and Chiou, L. R., 1988,"Recoil Pressure and Thermocapillary Force- Driven Flow during High Energy Beam Penetrating Process," Proceedings, 69th AWS Annual Welding Conference , American Welding Society, New Orleans, pp.22-24.

4.        Wei, P. S., and Lee (or Lii), T. W., 1989, "Missed Joint for Welding Dissimilar Metals with an Electron Beam," Proceedings, 70th AWS Annual Welding Conference, American Welding Society, Washington, D. C., pp.178-180.

5.        Fomin, S. A., and Wei, P. S., 1994, "The Shape Factor and Thermal Resistance in Contact Melting Problem," Proceedings of the 10th International Heat Transfer Conference, Brighton, U. K, editor: Hewitt, G. F., 14-18, Aug., Institution of Chemical Engineers, Warwickshire, U.K., Vol.4, pp. 25-30.

6.        Wei, P. S., 1999,"Factors Affecting Pore Formation in Metals Processing," the invited paper in memory of Professor Hwang, G. J., Proceedings of the 16th National Conference on Mechanical Engineering, Vol. 1, the Chinese Society of Mechanical Engineers, National Tsing Hua University, Hsinchu, Dec. 3-4, pp. H110-H124.

7.        Chiu, S. H., Kuo, Y. K., and Wei, P. S., 2000,"A Pore Trapped in Solid during Solidification," ASME-ZSITS International Thermal Science Seminar, 11-14, June, Bled, Slovenia, pp. 167-174.

8.        Wei, P. S., Chiu, S. H., and Ho, C. Y., 2001, "Thermal and Solutal Marangoni Convection in a Droplet Solidifying on a Cold Substrate," Proceedings of NHTC'0135th National Heat Transfer Conference, June 10-12, Anaheim, California,NHTC2001-20074.

9.        Wei, P. S., and Kuo, Y. K., 2002,"An Observation of the Growth of a Pore Trapped in Solid during Solidification," The 1st International Conference on Heat Transfer,Fluid Mechanics, and Thermodynamics, editor, J. P. Meyer, 8-10 April, Kruger National Park, South Africa, pp. 642-646.

10.    Wei, P. S., and Wang, S. C., 2002,"The Variations of Dynamic Electrical Resistance during Resistance Spot Welding," The 1st International Conference on Heat Transfer, Fluid Mechanics, and Thermodynamics, editor, J. P. Meyer, 8-10 April, Kruger National Park, South Africa, pp. 1025-1030.

11.    Wei, P. S., and Yeh, F. B., 2002, "Distinct Property Effects on Heat Transfer of a Liquid Layer Rapidly Solidified on a Substrate," The 1st International Conference on Heat Transfer, Fluid Mechanics, and Thermodynamics, editor, J. P. Meyer, 8-10 April, Kruger National Park, South Africa, pp. 661-665.

12.    Chen, K. Y., Lin, C. H., Huang, C. C., Wang, Z. P., and Wei, P. S., 2004,”An In-Situ Measurement and Analysis of Bubble/Pore Sizes in Solid during Solidification,” Proceedings of the 21^st National Conference on Mechanical Engineering, The Chinese Society of Mechanical Engineers, National Sun Yat-Sen University, Kaohsiung, 26-27, Nov., the 70^th birthday of Professor Cha'o-Kung Chen, pp. 93-98.

13.    Wei, P. S., Yeh, J. S., Yan, G. H., and Chung, F. K., 2006,“Scaling Thermocapillary Flow and Molten Pool Shape Irradiated by a Moving Distributed Energy Beam,” The 5th Asian-Pacific Conference on Aerospace Technology and Science, APCATS’2006, Chair: F. Zhuang, Beijing University of Aeronautics and Astronautics, Oct. 30- Nov. 3, 2006, Guilin, China, A2-7.

14.    Hsiao, C. C., Wei, P. S., and Chen, K. Y., 2008, “Universal Force Diagrams of a Microbubble in Static Fluid on a Surface,” Proceedings of MNHT2008 Micro/Nanoscale Heat Transfer International Conference, (Chair D. Y. Tzou), January 6-9, Tainan, Taiwan, MNHT2008-52048.

15.    Hsiao, C. C., Wei, P. S., and Hsiao, S. Y., 2008, “Bubble Entrapped in Solid during Solidification,” The 8th International Conference on Trends in Welding Research, ASM, Chairs: S. A. David, T. DebRoy, J. N. DuPont, T. Koseki, and H. B. Smartt, Pine Mountain, GA, USA, June 1-6, Section 3, pp. 190-193.

16.    Lin, L. L, Huang, C. T., Wei, P. S., Luo, S. C., and Kuo, Y. L., 2008, “Using PIC Method to Predict Transport Variables in Plasma Near an Electrically Biased Surface,“ The 7^th International Symposium on Heat Transfer ISHT7, Beijing, China, 26-29, Session 16.

17.    Kuo, S. C., Wei, P. S., and DebRoy, T., 2009, “Entrainment Effects on Annular Flow in a Keyhole with Free Surface, “The 6^th International Symposium on Multiphase Flow, Heat Mass Transfer and Energy Conversion (ISMF2009), edited by Liejin Guo, Xi’an Jiaotong University, Xi’an, China, July 11-15, 2009, MF-05.

18.    Wei, P. S., and Hsiao, S. Y., 2009, “Pore Formation during Solidification,“ 2009 Electronic Technology Symposium, 19^th June, I-Shou University, Kaohsiung, Taiwan, AP-46.

19.    Wei, P. S., and Hsiao, C. C., 2009,“Controlling Microbubble or Pendant Drop,“ Automation 2009, The 10^th International Conference on Automation Technology, June 27-29, National Cheng Kung University, Tainan, Taiwan, Session G3, pp.128.

20.    Kuo, S. C., Wei, P. S., and DebRoy, T., 2009,“The Effects of Mach Number on Keyhole Shape in High Intensity Beam Welding or Drilling,” ASME International Manufacturing Science and Engineering Conference (MSEC2009), Oct. 4-7, 2009, West Lafayette, IN, Paper No: MSEC2009-84022

21.    Wei, P. S., and Hsiao, S. Y., 2009,“Mechanism of Pore Formation in Solid,“ The 4^thInternational Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Nangang Exhibition Hall, Taipei,Taiwan, ROC, Oct. 21-23, 2009, TW018-1.

22.    Hsiao, S. Y., and Wei, P. S., 2009, “A Model to Predict Pore Shape in Solid during Solidification,” ASME International Mechanical Engineering Congress & Exposition (IMECE2009), Lake Buena Vista, Florida, Miscellaneous Multi-Physics Problems in Electronic Packaging, Session 5-7-1, Nov. 13-19, 2009, IMECE2009-10344.

23.    Chang, C. C., and Wei, P. S., 2009, “Analytical Three-Dimensional Temperature Field in Keyhole Welding,” The FABTECH International & AWS Welding Show, Chicago, Nov. 15 - 18, 2009, Session 7-C Welding Modeling.

24.    Wei, P. S., and Wu, T. H., 2010, “Transport Processes in AC Resistance Spot Welding,” 2010 Electronic Technology Symposium, 18^th June, I-Shou University, Kaohsiung, Taiwan, AP-40.

25.    Wu, T. H., Ho, J. E., and Wei, P. S., 2010,“Dynamic Electrical Resistance Effects in Resistance Spot Welding,” The 5^th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Nangang Exhibition Hall, Taipei,Taiwan, ROC, Oct. 20-22, 2010. Paper No.:TW042.

26.    Wei, P. S., Chuang, K. C., and Ku, J. S., 2010,“Spiking and Humping Defects in Keyhole Welding,” Proceedings of the ASME 2010 International Mechanical Engineering Congress & Exposition (IMECE2010), Nov. 12-18, 2010, Vancouver, British Columbia, Canada, IMECE2010-39513.

27.    Wei, P. S., Chuang, K. C., Ku, J. S., and DebRoy, T., 2010,“Spiking in Electron Beam Welding,”The FABTECH International & AWS Welding Show, Atlanta, Nov. 2 - 4, 2010, Session 10: Process Modeling-D.

28.    Wei, P. S., Lin, C. L., and Ting, C. N., 2011,“Scaling Thermocapillary Surface Velocity in Weld Pool,” ASME/JSME 8^th Thermal Engineering Joint Conference, March 13-17, Honolulu, Hawaii, AJTEC2011-44068.

29.    Wu, T. H., Ho, J. E., and Wei, P. S., 2011, “Thermal Processes Affected by Curie Temperature during Resistance Spot Welding,” 2011 Electronic Technology Symposium, 10^th June, I-Shou University, Kaohsiung, Taiwan, AP-08.

30.    Wu, T. H., and Wei, P. S., 2011, “Curie Temperature Effects on Resistance Spot Welding,” The 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), NTUH International Convention Center, Taipei, Taiwan, ROC, Oct. 18-21, 2011. Paper No.:TW004-1.

31.    Wei, P. S., Lin, C. L., and Liu, H. J., 2011,“Scale Analysis of Thermocapillary Weld Pool Shape with High Prandtl Number,” Proceedings of the ASME 2011 International Mechanical Engineering Congress & Exposition (IMECE2011), Nov. 11-17, 2011, Denver, Colorado, IMECE2011-62464.

32.    Wei, P. S., Lin, C. L., Liu, H. J., and DebRoy, T., 2011,“Scaling Thermocapillary Weld Pool Shape,” The FABTECH International & AWS Welding Show, Chicago, Nov. 14 - 17, 2011, Session 8: Laser Materials Processing.

33.    Wei, P. S., 2011,“Unified Prediction of Fusion Zone Shape Produced by Laser or Electron Beam,” Proceedings of IWHT2011, 2011 International Workshop on Heat Transfer Advances for Energy Conservation and Pollution Control, Oct. 17-20, 2011, Xi’an, China, Keynote 3-2.

34.    Wei, P. S., Hsiao, S. Y., and Lin, S. M., 2012,“Transition from Bubble Entrapment to Pore Formation,” 2012 Electronic Technology Symposium, 1^st June, 2012, I-Shou University, Kaohsiung, Taiwan, AP-01, pp. 141-144.

35.    Wei, P. S., 2012,“Simulation of Resistance Spot Welding,” The 2^nd International Symposium on Computer-Aided Welding Engineering (CAWE 2012), Jinan, China, edited by C. S. Wu, Shandong University, Session C1: Welding metallurgy, Invited C1, Aug. 23-26, 2012

36.    Wei, P. S., Hsiao, S. Y., and Lin, S. M., 2012, “Modeling of Pore Formation in Solid,” The 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Nangang Exhibition Hall, Taipei,Taiwan, ROC, Oct. 24-26, 2012. Paper No.:TW001-1.

37.    Wei, P. S., and Hsiao, S. Y., 2012,“Modeling of Pore Shape in Welding,” The FABTECH International & AWS Welding Show, Session 7, Welding Metallurgy, Las Vegas, Nov. 12 - 14, 2012.

38.    Wei, P. S., and Hsiao, S. Y., 2012, “Effects of Bubble Growth and Solidification Rate on Pore Formation in Solid,” Proceedings of the ASME 2012 International Mechanical Engineering Congress & Exposition (IMECE2012), Nov. 9-15, 2012, Houston, Texas, IMECE2012-85922.

39.    Wei, P. S., 2012, “Controlling Fusion Zone Shape and Peak Temperature Produced by Laser or Electron Beam,” the 14th International Conference on Electronic Materials and Packaging, EMAP2012, Paper No: P030, Dec. 13-16, 2012, Hong Kong

40.    Wei, P. S., and Wu, T. H., 2013, “Electrical-Magnetic-Fluid-Thermal-Metallurgical Phenomena during Resistance Spot Welding,” 2013 Electronic Technology Symposium, 24^thMay, 2013, I-Shou University, Kaohsiung, Taiwan, EP-08.

41.    Wu, J. H., Chao, T. C., and Wei P. S., 2013, “Controlled Efficiency during Drilling with a High Intensity Beam,” Proceedings of the ASME 2013 International Mechanical Engineering Congress & Exposition (IMECE2013), November 15-21, 2013, San Diego, California, USA, IMECE2013-63061.

42.    Wei, P. S., 2013, 2013,“Nugget Shape Control in Resistance Spot Welding,” The 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT-IAAC 2013), Nangang Exhibition Hall, Taipei,Taiwan, ROC, Paper No.:TW009-1, Oct. 22-25, 2013.

43.    Wei, P. S., Chou, M. F., and Chou, S. K., 2013,”Heat Generation due to Surface Plasmon,” the 8th Asia-Pacific International Symposium on the Basics and Applications of Plasma Technology (APSPT-8), National Chiao Tung University, Hsinchu, Taiwan, Dec. 20-22, 2013, pp. 115

44.    Wei, P. S., and Wu, T. H., 2014, “Heat Transfer Affected by Electrode Geometry during Resistance Spot Welding,” Proceedings of the ASME 2014 International Mechanical Engineering Congress & Exposition (IMECE2014), Nov. 14-20, 2014, Montreal, Canada, IMECE2014-36630.

45.    Wu, J. H., Wei, P. S., and Chao, T. C., 2014, “Incapability of Laser Drilling” 2014 the 7^th Electronic Technology Symposium, 23th May, 2014, I-Shou University, Kaohsiung, Taiwan, Paper No. CP01.

46.    Wu, J. H., Wei, P. S., and Chao, T. C., 2014, “Controlling Efficiency of Laser Drilling,” The 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT-EMAP 2014), Nangang Exhibition Hall, Taipei,Taiwan, ROC, Oct. 22-24, 2014, Paper no.TW009-1

47.    Wei, P. S., and Wu, T. H., 2014,“Electrode Geometry Effects on Nugget Growth and Heat Transfer during Resistance Spot Welding,” The FABTECH International & AWS Welding Show, Session 8: Advances in Weld Modeling-1: 8F, Nov. 11 - 13, 2014, Atlanta, GA, USA.

48.    Hsiao, S. Y., and Wei, P. S., 2015, “Prediction of Pore Shape in Welding Solidification,” The FABTECH International & AWS Welding Show, Nov. 9 - 12, 2015, Chicago, Illinois, USA.

49.    Wei, P. S., and Hsiao, S. Y., 2015,”Geometrical Effects of an Entrapped Bubble on Pore Shape in Solid,” Proceedings of the ASME 2015 International Mechanical Engineering Congress & Exposition (IMECE2015), Nov. 13-19, 2015, Houston, Texas, IMECE2015-50490.