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期刊論文 (吳美玲老師)

arow.gif (1479 bytes)  A:  期刊論文：(under Review)

* Corresponding Author (2021)

  1.  Wu*, M.L., J.S. Lan. (2021).  Investigation of Adhesives Material in Hermetic MEMS Package for Interfacial Crack between the Silver Epoxy and the Metal Lid during the Precondition Test.  Materials, under reivew.  [SCI, EI]. 

 

arow.gif (1479 bytes)  A:  期刊論文：(已刊登)

*  Corresponding Author (2008 ~2021)

  1. Wu*, M.L., J.S. Lan., Wong, W. J. (2021).  Simulation and Experimental Study to analyze the grinding force and Warping of Silicon Wafers Subjected to Back-grinding Process.  IEEE Transactions on Components, Packaging and Manufacturing Technology, Accepted.  [SCI, EI].
  2. Wu*, M.L., J.S. Lan. (2021).  Prediction of delamination failure in Quad Flat No-lead (QFN) Packages Using Combined Experimental and Simulation Methods.  IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 11, Issue 5, pp. 785-792.  [SCI, EI]. 
  3. Wu*, M.L., J.S. Lan. (2019).  Simulation and Experimental Study of the Warpage of Fan-out Wafer-level Packaging: The Effect of the Manufacturing Process and Optimal Design.  IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 9, Issue 7, pp. 1396-1405.  [SCI, EI]. 
  4. Wu*, M.L., J.S. Lan. (2018).  Prediction of Fatigue Resistance in Lead-free Ni-doped SAC 1205 Solder Alloys Using a Rate-Dependent Material Model and Subjected to Drop Tests.  IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 8, Issue 10, pp. 1777 - 1787.  [SCI, EI]. 
  5. Wu, M.L., Chiou, S. Y., Hwang, Y. M. (2018).  Empirical Equations for Optimization Conditions in Thermal Compression Bonding of Copper Pillar Flip Chip Packages.  IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 8, Issue 6, pp. 1116-1120.  [SCI, EI]. 
  6. Wu*, M.L., Lan, J.S.  (2018). Reliability and Failure Analysis of SAC 105 and SAC 1205N Lead-free Solder Alloys during Drop Test Events.  Microelectronics Reliability.  80(2018), pp. 213–222.  [SCI, EI].    
  7. Wu*, M.L., Lan, J.S.  (2017).  Investigation and prediction of Solder Joint Failure analysis for ball grid array package subject to mechanical bending environment.  Soldering & Surface Mount Technology, Vol. 29, Issue 2, pp.75 - 84.  [SCI, EI].  
  8. Wu*, M.L., Lan, J.S.  (2016).  Analytical and finite element methodology modeling of the thermal management of 3D IC with through silicon via.  Soldering & Surface Mount Technology.  Vol. 28, Issue 4, pp. 177 - 187.  [SCI, EI].  
  9. Wu*, M.L., Chen Y.Y.  (2016).  A scalable electrical model for 3D IC with through silicon via.  Journal of the Chinese Society of Mechanical Engineers.  Vol. 37, No. 6, pp. 635~645..  [SCI, EI].  
  10. Wu*, M.L., Chen Y.Y.  (2016).  Electrical modeling of a plated-through-hole microstructure in multilayered printed circuit boards.  Journal of the Chinese Society of Mechanical Engineers.  Vol. 37, No. 5, pp. 427-433.  [SCI, EI].  
  11. Wu*, M.L.  (2012).  Assessing the impact of uncertainty in physics-of-failure analysis of microelectronics damage.  Materials Science and Engineering: A.  Vol. 558, pp. 259–264.  [SCI, EI]. 
  12. Wu, L. Y., Chiang, T. Y., Tsai, C. N., Wu, M.L., & Chen*, L. W.  (2012).  Design of an acoustic bending waveguide with acoustic metamaterials via transformation acoustics.  Applied Physics A: Materials Science & Processing.  Vol. 109, No. 3, pp. 523-533.  [SCI, EI].
  13. Wu*, M.L.  (2010).  Design of experiments to investigate reliability for solder joints PBGA package under high cycle fatigue.  Microelectronics Reliability.  Vol. 50, Issue 1, pp. 127–139.  [SCI, EI].
  14. Wu*, M.L.  (2010).  Microelectronic packaging reliability using the RSM technique.  Soldering & Surface Mount Technology.  Vol. 22, Issue 2, pp.3 – 12.  [SCI, EI].
  15. Wu*, M.L., & Barker, D.  (2010).  Rapid assessment of BGA life under vibration and bending, and influence of input parameter uncertainties.  Microelectronics Reliability.  Vol. 50, Issue 1, pp. 140–148.  [SCI, EI].
  16. Wu*, M.L., & Barker, D.  (2010).  Rapid Assessment of BGA Fatigue Life under Vibration Loading.  IEEE Transactions on Advanced Packaging.  Vol. 33, Issue 1, pp. 88 – 96.  [SCI, EI].
  17. Wang, H. W., Wu, M.L., & Chen*, L. W.  (2010).  Focusing analysis of a complex photonic crystal slab with negative refraction.  Physica B: Condensed Matter.  Vol. 405, Issue 19, pp. 4157–4162.  [SCI, EI]
  18. Wu*, M.L.  (2009).  Vibration-induced fatigue life estimation of ball grid array packaging.  Journal of Micromechanics and Microengineering.  Vol. 19, Issue 6, article id. 065005 (12 pp).  [SCI, EI].
  19. Wu*, M.L., Wu, L. Y., Yang, W. P., & Chen, L. W.  (2009).  Elastic wave band gaps of 1D phononic crystals with functionally graded materials.  Smart Materials and Structures.  Vol. 18,  No. 11, 115013 (8 pp).  [SCI, EI].
  20. Wu*, M.L.  (2008).  Fundamental understanding of BGA packaging subjected to vibration loads.  Journal of the Chinese Society of Mechanical Engineers.  Vol. 29, No. 6, pp. 509-518.  [SCI, EI].
  21. Wu, L. Y., Wu, M.L., & Chen*, L. W.  (2008).  The narrow pass band filter of tunable 1-D phononic crystals with a dielectric elastomer layer.  Smart Materials and Structures.  Vol. 18, No. 1, 015011 (8pp).  [SCI, EI].
  22. Wu, L. Y., Chen*, L. W., & Wu, M.L.  (2008).  The nondiffractive wave propagation in the sonic crystal consisting of rectangular rods with a slit.  Journal of Physics: Condensed Matter, Vol. 20, No. 29, pp. 295229.  [SCI, EI]. 

 

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