跳到主要內容區

Top

研討會論文 (吳美玲老師)

arow.gif (1479 bytes)   B:  國際、國內研討會會議論文

*  Corresponding Author (2008 ~2020)

  1. Lan, J. S., & Wu,* M.L. (2020).  Warpage Simulation and Analysis for Panel Level Fan-out Package.  ITHERM 2020 Conference, May 26 - 29.  Orlando, Florida, USA: Walt Disney World Swan & Dolphin Resort.
  1. Wong, W. J., & Wu,* M.L. (2020).  Simulation Method of Ultra-Thin Silicon Wafers Warpage.  ITHERM 2020 Conference, May 26 - 29.  Orlando, Florida, USA: Walt Disney World Swan & Dolphin Resort.
  1. Wang, C. K., & Wu,* M.L. (2020).  Simulation and Analysis of Quad Flat No-lead Package (QFN) under Moisture, and Thermal stress.  ITHERM 2020 Conference, May 26 - 29.  Orlando, Florida, USA: Walt Disney World Swan & Dolphin Resort.
  1. Lan, J.  S., Wu,* M.L.  (2019). Physics of Failure Based Simulation and Experimental Testing of Quad Flat No-lead Package.  ECTC 69th Electronic Components and Technology Conference, May 28 - May 31.  Las Vegas, Nevada, USA: The Cosmopolitan of Las Vegas
  1. Lan, J.  S., Wu,* M.L.  (2019). Delamination and Cracking Effects in Quad Flat Package.  ITherm 2019  Conference, May 28 - May 31.  Las Vegas, Nevada, USA: The Cosmopolitan of Las Vegas
  1. Wang, C.  K., Wu,* M.L.  (2018). Effects of Moisture and Temperature on Quad Flat No-lead (QFN) Package.  EMAP 2018 Conference, Dec 17 – Dec 20.  Hong Kong, China: Hong Kong University of Science and Technology
  1. Huang, Y.  T., Wu,* M.L.  (2018). Development of Influence of Bonding Materials Distribution for MEMS Pressure Sensor.  EMAP 2018 Conference, Dec 17 – Dec 20. Hong Kong, China: Hong Kong University of Science and Technology
  1. Wong, W.  J., Wu,* M.L.  (2018). Numerical Approach to Predict Silicon Wafer Grinding Warpage.  EMAP 2018 Conference, Dec 17 – Dec 20.  Hong Kong, China: Hong Kong University of Science and Technology
  1. Lan, J.  S., Wu,* M.L.  (2018). Simulation of High Bandwidth Package on Package (HBPoP) Warpage and its effect on Thermal Cycling.  EMAP 2018 Conference, Dec 17 – Dec 20.  Hong Kong, China: Hong Kong University of Science and Technology
  1. Lan, J.  S., & Wu*, M.L.  (2018).  Warpage Simulation/ Experiments and Analysis of 12” Wafer Level Fan-out Packaging Technology.  ECTC 2018 Conference, May 29 - June 1.  San Diego, California, USA: Sheraton San Diego Hotel & Marina.
  1. Lan, J.  S., & Wu*, M.L.  (2018).  Life Expectancies of Ni-doped SAC Solder Alloy Subjected to Drop Test Loading.  ITHERM 2018 Conference, May 29 - June 1.  San Diego, California, USA: Sheraton San Diego Hotel & Marina. 
  1. Hsiao, C.  W., & Wu*, M.L. (2018). Warpage Simulation for Fan-Out Wafer Level Packaging Investigation.  ECTC 2018 Conference, May 29 – June 1.  San Diego, California, USA: Sheraton San Diego Hotel & Marina.
  1. Hsiao, C.  W., & Wu*, M.L. (2018).  Simulation Improved Testing of Fan-out Packaging.  ITHERM 2018 Conference, May 29 - June 1.  San Diego, California, USA: Sheraton San Diego Hotel & Marina.
  1. Lan, J.  S., & Wu*, M.L.  (2017).  Finite Element Method based Warpage Prediction Strategy of Fan-out Wafer Level Package.  EMAP 2017 Conference, 25-28 Sep.  Matsue, Shimane, Japan:  Shimane Prefectural Convention Center.
  1. Lan, J.S., & Wu*, M.L.  (2016).  Reliability of SAC105 and SAC1205N under Drop Tests.  The 49th International Symposium on Microelectronics, 11-13 October.  Pasadena Convention Center, USA.  
  1. Lan, J.S., & Wu*, M.L.  (2016).  Simulation of Micro-bump Interconnections Failure Analysis for 2.5D IC Packaging.  The 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2016), 17-20 April.  Montpellier, France:  University of Montpellier.  
  1. Lan, J.S., & Wu*, M.L.  (2015).  Simulation of Micro-bump Interconnections Failure Analysis for 2.5D IC Packaging.  Ministry of Science and Technology (MOST) 2015, 11-12, Dec.  Kaohsiung, Taiwan: Garden Villa. 
  1. Lan, J.S., & Wu*, M.L.  (2014).  Simulation 3D TSV for Stress-Strain Characteristics under Mechanical and Thermo-mechanical Loading.  IMPACT-EMAP 2014 Conference, 22-24 October.  Teipei, Taiwan: Taipei Nangang Exhibition Center.  
  1. Wang, M.H., Wang, C.T., Hung, C.P., Yang, P.F., Lee, C.C., & Wu*, M.L.  (2014).  Thermal-moisture Coupling Effects on PA and UF Warpage Stress of 2.5D IC Package by FE Simulation Analysis.  IMPACT-EMAP 2014 Conference, 22-24 October.  Teipei, Taiwan: Taipei Nangang Exhibition Center.  
  1. Liu, B.Y., & Wu*, M.L.  (2014).  Simulation Investigation on the Coupled Electrical-thermal-mechanical Analysis of 3D Package-on-Package (POP).  IMPACT-EMAP 2014 Conference, 22-24 October.  Taipei, Taiwan: Taipei Nangang Exhibition Center.
  1. Tseng, H.K., & Wu*, M.L. (2014).  Dynamic Simulation for Microelectronic Packaging of Al Pad/Underlying Pad Structure during Copper Wire Bonding.  IMPACT-EMAP 2014 Conference, 22-24 October.  Taipei, Taiwan: Taipei Nangang Exhibition Center.  
  1. Lan, J.S., & Wu*, M.L.  (2014).  An Analytical Model for Thermal Failure Analysis of 3D IC Packaging.  The 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2014), 7-9 April.  Ghent, Belgium:  Marriott Hotel.  
  1. Wang, M.H., & Wu*, M.L.  (2014).  Thermo-mechanical Stress of Underfilled 3D IC Packaging.  The 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2014), 09-07 April.  Ghent, Belgium:  Marriott Hotel.  
  1. Lan, J.S., & Wu*, M.L.  (2014).  Mechanical and Thermo-mechanical Stress Considerations in Applying 3D ICs to a Design.  The 64th Electronic Components and Technology Conference (ECTC 2014), 27~30 May.  Orlando, Florida, USA: Walt Disney World Swan & Dolphin Resort.  
  1. Lan, J.S., & Wu*, M.L.  (2013).  Design for Solder Joint Fatigue Life of BGA Package Subject to Mechanical Environment. IMAPS 2013 conference, September 29 - October 3. Orlando, Florida, USA:  Rosen Centre Hotel.  
  1. Tsai, Y.C., & Wu*, M.L.  (2013).  Thermal Cycle Consideration in Applying Lead-Free TFBGA Simulation to a Design. IMAPS 2013 conference, September 29 - October 3. Orlando, Florida, USA:  Rosen Centre Hotel.  
  1. Tseng, H.K., & Wu*, M.L.  (2013). Electro-Thermal-Mechanical Modeling of Wire Bonding Failures in IGBT. International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) 2013 conference, 24-26 October. Taipei, Taiwan:  Taipei Nangang Exhibition Center.  
  1. Wu*, M.L., Chauhan P., Osterman M., & Pecht M.  (2013).  Evolution of Microstructure of SAC305 and SN100C Solders on ENIG/Cu Pads under Isothermal Aging.  ICEP-IAAC 2013 conference, 10-12 April.  Osaka, Japan:  Osaka International Convention Center. 
  1. Luo, Y.C., & Wu*, M.L.  (2013).  Finite Element Analysis for 3D IC Packaging Structural Design during Thermal cycling.  ICEP-IAAC 2013 conference, 10-12 April.  Osaka, Japan:  Osaka International Convention Center.  
  1. Chen, Y.Y., & Wu*, M.L.  (2013).  Through Silicon Vias Design Using the Scattering Matrix.  ICEP-IAAC 2013 conference, 10-12 April.  Osaka, Japan:  Osaka International Convention Center.  
  1. Lan, J.S., & Wu*, M.L.  (2013).  Thermal Management for 3D-WLCSP Package.  ICEP-IAAC 2013 conference, 10-12 April.  Osaka, Japan:  Osaka International Convention Center.  
  2. Wang, M.H., & Wu*, M.L.  (2013).  Thermo-mechanical Stress of Underfilled 3D IC Packaging.  ICEP-IAAC 2013 conference, 10-12 April.  Osaka, Japan:  Osaka International Convention Center.  
  1. Lai, Y.S., & Wu*, M.L.  (2013).  Power Cycling Simulation of Flip Chip BGA Package during Stress Relaxation.  ICEP-IAAC 2013 conference, 10-12 April.  Osaka, Japan:  Osaka International Convention Center.  
  1. Lan, J.S., & Wu*, M.L.  (2012).  Reliability Simulation and Structural Optimization for Mechanical Loading.  The 14th International Conference on Electronics Materials And Packaging (EMAP), 13–16 December, Lantau Island, Hong Kong: Novotel Hong Kong Citygate.  
  1. Wang, M.H., & Wu*, M.L.  (2012).  Packaging of Microelectronics for Thermo-Mechanical Environments.  The 14th International Conference on Electronics Materials And Packaging (EMAP), 13–16 December, Lantau Island, Hong Kong: Novotel Hong Kong Citygate.  
  1. Hung, K.K., & Wu*, M.L.  (2012).  Microstructural Analysis of Lead-free Solder Joint under Thermo-mechanical Loadings.  The 14th International Conference on Electronics Materials And Packaging (EMAP), 13–16 December, Lantau Island, Hong Kong: Novotel Hong Kong Citygate.  
  1. Tsai, Y.C, Lai, Y.S., & Wu*, M.L.  (2012).  Modeling of Microstructures and Their Effect on Lead-free Solder Joints Fatigue Life under Thermal Cycle.  Proceedings of the ASME 2012 International Mechanical Engineering Congress & Exposition, 09-15 November.  Houston, Texas:  the Hilton Americas and the George R. Brown Convention Center.  
  1. Hung, K.K., Yang C.C., & Wu*, M.L.  (2012).  Finite Element Analysis on Stress in micro-BGA Solder Joint with Different Substrates under Thermomechanical Loading.  Proceedings of the ASME 2012 International Mechanical Engineering Congress & Exposition, 09-15 November.  Houston, Texas:  the Hilton Americas and the George R. Brown Convention Center.  
  1. Chen, Y.Y., & Wu*, M.L.  (2012).  Failure modes and FEM Analysis of Conductive Anodic Filament Resistance during high-frequency electromagnetic of PCB.  Proceedings of the 7th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), and SIPO International 3D IC Conference, 24-26 October.  Taipei, Taiwan:  Taipei Nangang Exhibition Hall.  
  1. Luo, Y.C., & Wu*, M.L.  (2012).  Critical Parameter Selection for Thermal Cycle of FBGA Fatigue Life.  Proceedings of the 7th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), and SIPO International 3D IC Conference, 24-26 October.  Taipei, Taiwan:  Taipei Nangang Exhibition Hall.  
  1. Wu*, M.L., George, E., & Pecht, M (2012).  Simulation Assisted Physics of Failure based Reliability Assessment.  ICEP-IAAC 2012 conference, 17-20 April.  Tokyo, Japan:  Tokyo Big Sight. 
  1. Lan, J. S., & Wu*, M.L.  (2012).  Quick Assessment Approach of Lead-free Solder Joint Fatigue under Mechanical Bending.  ICEP-IAAC 2012 conference, 17-20 April.  Tokyo, Japan:  Tokyo Big Sight. 
  2. Yang, J. R., & Wu*, M.L.  (2012).  An Analysis of Failure of Microelectronic Packaging Due to Conductive Anodic Filament Formation.  ICEP-IAAC 2012 conference, 17-20 April.  Tokyo, Japan:  Tokyo Big Sight.  
  1. Lan, J. S., & Wu*, M.L.  (2012).  Stress Analysis of Multilayered Printed Circuit Board under Mechanical Loading.  Pan Pacific Microelectronics Symposium, Failure Modeling and Design, 14-16 February.  Kauai, Hawaii:  Sheraton Poipu Resort. 
  1. Wang, Y. W., & Wu*, M.L.  (2012).  Critical Parameter Selection for Solder Joints of Microelectronic Products under Thermal Cycling.  Pan Pacific Microelectronics Symposium, Failure Modeling and Design, 14-16 February.  Kauai, Hawaii:  Sheraton Poipu Resort. 
  1. Wu*, M.L.  (2011).  Global Sensitivity Analysis of Solder Joint Fatigue Life Model.  Proceedings of the ASME 2011 International Mechanical Engineering Congress & Exposition, 11-17 November.  Denver, Colorado:  the Hyatt Regency Denver and the Colorado Convention Center. 
  1. Wu, L. Y., Chiang, T.  Y., & Wu, M.L., & Chen*, L.  W.  (2011).  An acoustic metamaterial bending waveguide design using transformation acoustics.  Proceedings of the ASME 2011 International Mechanical Engineering Congress & Exposition, 11-17 November.  Denver, Colorado:  the Hyatt Regency Denver and the Colorado Convention Center
  1. Yang, J. L., & Wu*, M.L.  (2011).  Models for physics of Failures Analysis during Printed Wiring Board Bending.  International Microsystems, Packaging Assembly and Circuit Technology Conference, 18-21 October.  Taipei, Taiwan:  NTUH International Convention Center. 
  1. Wang, Y. W., & Wu*, M.L.  (2011).  Failure of Lead-Free Solder Joint under Thermal Cycling”, International Microsystems, Packaging Assembly and Circuit Technology Conference, 18-21 October.  Taipei, Taiwan:  NTUH International Convention Center. 
  1. Wu*, M.L.  (2011).  Global Uncertainty Analysis of Solder Joint Fatigue Life Model in Random Vibration Environment.  International Microsystems, Packaging Assembly and Circuit Technology Conference, 18-21 October.  Taipei, Taiwan:  NTUH International Convention Center. 
  1. Wu*, M.L.  (2010).  Assessing the Impact of Uncertainty in Physics of Failure Analysis of BGA solder joints Fatigue Damage.  Proceedings of the 5th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), and SIPO International 3D IC Conference, 20-22 October.  Taipei, Taiwan:  Taipei Nangang Exhibition Hall. 
  1. Wu*, M.L., Pecht, M.  (2009).  Semiconductor Component Qualification.  Proceedings of the 4th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), and SIPO International 3D IC Conference, 19-23 October.  Taipei, Taiwan:  Taipei Nangang Exhibition Hall. 
  2. Wu*, M.L.  (2009).  Fatigue Life Estimation of BGA Packaging under Vibration and Bending Loads.  Materials for Advaned Metallization Conference (MAM2009), 8-11 March.  Parvis Louis Neel, Grenoble: Maison des Micro et Nano Technologies (MMNT) Minatec Center
  1. Wu*, M.L.  (2008).  Vibration Failure Assessment Methodology for the Fatigue Life of Ball Grid Array BGA Solder Joints.  Proceedings of the 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference and the 10th International Conference on Electronics Materials and Packaging (EMAP), 22-24 October.  Taipei, Taiwan:  Taipei Nangang Exhibition Hall. 
  1. Wu*, M.L.  (2008).  Vibration Assessment Methodology of Ball Grid Array (BGA) Solder Joints Fatigue Life.  SMTA International Conference (SMTAI ’08), Aug. 17-21.  Orlando, Florida:  Disney’s Coronado Springs Resort and Convention Center. 
瀏覽數: