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專利(林韋至)

1.光源裝置
(Apparatus of light source)
USA: License Number: US2005/0264157A1
Japan: License Number: JP9-245742A
China: License Number: CN1691267A
Taiwan: License Number: I359439
Korea: License Number: KR100945900B1

2.光源裝置與背光模組
(Discharge emission backlight module)
Japan: Apply Number: 2008-048556
Taiwan: License Number: 200837456
China: Apply Number: 00710305577.3

3.顯示畫素結構與顯示裝置
(Pixel structure of display and display apparatus)
Taiwan: License Number: I353618
Japan: Apply Number: 326600/2007
Korea: Apply Number: 10-2007-0132436
China: Apply Number: 200710199162.2
USA: Apply Number: 1/958,393

4.電子發射式發光元件及其發光方法
(Electron emission device method and light emitting method)
Korea: License Number: KR20080080950A
USA: License Number: US6097138
Japan: License Number: 326599/2007
China: License Number: CN1618113A
Taiwan: License Number: I366214

5.顯示畫素結構與顯示裝置
(Display pixel structure of display and display apparatus)
USA: License Number: US2005/0017648A1
China: License Number: CN1875665A
Taiwan: License Number: I353618

6.放電式場發射元件及應用此元件的光源裝置與顯示裝置
(Discharge field emission device and light source apparatus and display apparatus applying the same)
USA: License Number: US2004/0192153A1
Taiwan: License Number: I494425

7.投影系統光源
(Light source for projection system)
Taiwan: License Number: I301288
Japan: License Number: JP2005-129400 A
USA: Apply Number: 11/417,048

8.可控制結構尺寸之液態重力蝕刻停止方法
(A liquid-based etching-stop technique for structure dimension control)
Taiwan: License Number: I284953
USA: License Number: 7,435,355

9.場發射顯示器 
(Field emission display)
USA: Apply Number: 11/477,938
Japan: License Number: JP2005-158747 A
Taiwan: License Number: I296180

10.場發射背光模組
(Field emission backlight module)
Taiwan License Number: I304507
Japan: License Number: JP2005-174852 A
USA: License Number: US2005/0162066 A

11.奈米碳管與探針接合之製作方法和結構.
(A method for assembling carbon nanotubes and an apparatus thereof)
Taiwan: License Number: I293766

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