期刊論文(Refereed Journal Papers)

 
1.Yih-Tun Tseng* and Tzu-Yu Hung and Fu-Ping Huang, 2005, 
Active Quadrangular-Pyramid-Shaped Fiber Endface Polishing Method for Automation, 
IEEE Transactions o­n Advanced Packaging, Submitted (SCI) (NSC93-2212-E-110-017)
2.Yih-Tun Tseng, Jui-Hung Liu, Mu-Yue Cheng, 2005, 
“Active Solder Dispenser for Fabricating Fiber-Solder-Ferrule Assembly in Laser Module Packaging”, 
IEEE Transactions o­n Components and Packaging Technologies, Submitted (SCI) (NSC92-2212-E-110-009)

3.Yih-Tun Tseng, Hsin-Chin Sung, 2005, 
“A Novel Inspection of Fiber Post-Weld-Shift in Butterfly Laser Module Packaging”, 
IEEE Transactions o­n Advanced Packaging, Accepted o­n Dec, 2004.(SCI) (NSC92-2212-E-110-009)

4.W. Cheng, M. Sheen,C. Chang and Yih-Tun Tseng, 2004, 
“An Optimum Approach for Reduction of Fiber Alignment Shift of Fiber-Solder-Ferrule Joints in Laser Module Packaging”, 
Journal of Lightwave Technology, Vol. 22, No.2, Feb., 589-594.(SCI) (NSC91-2212-E-110-024)

5.Yih-Tun Tseng, Yung-Ching Chang, 2003, 
“Active Fiber-Solder-Ferrule Alignment Method for High-Performance Opto-Electronic Device Packaging”, 
IEEE Transactions o­n Components and Packaging Technologies, Vol. 26, No.3, Sept., 541-547.
(SCI) (NSC91-2212-E-110-024)

6.Yih-Tun Tseng, Jui-Hung Liu, 2003, 
“High Speed and Precise Position of the X-Y Table”, Control Engineering Practice, 11, 357-365.
(EI)  (NSC90-2212-E-110-041)