研討會論文(施孟鎧老師)
1. Meng-kai Shih, Guan-Sian Lin, Eddie Hsu and Jonny Yang, “Electronic Packaging Interfacial Strength Measurement, Thermal-Moisture Induced Delamination Investigation and Structure Design Optimization,” ASME 2023 International Mechanical Engineering Congress and Exposition (IMECE2023), New Orleans, LA, USA, 2023.
2. Shi-Jie Chen, Yi-Hao Chen, Meng-kai Shih, I-Hung Lin, Bai-Yao Lou and Tom Ni, “Thermal Cycling Reliability Analysis of Copper Pillar Bumps in Advanced Fan-Out Packaging,” International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, Taiwan, 2023.
3. Meng-Kai Shih, Yu-Hao Liu, Guan-Sian Lin, Eddie Hsu and Jonny Yang, “Electronic Packaging Interfacial Strength Measurement and Delamination Investigation,” International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 2023.
4. 施孟鎧、賴威宏、陳宣予、陳道隆, “2.5D IC與FOCoS先進封裝結構之機械與熱特性分析”, 中華民國力學學會年會暨第四十六屆全國力學會議 (高科大), 2022.
5. 林冠賢、徐明志、楊玉林、施孟鎧, “電子封裝界面強度與濕-熱耦合脫層損傷分析”, 中國機械工程學會第39屆全國學術研討會 (聯合大學), 2022.
6. 施孟鎧、陳燦賢、陳道隆, “先進扇出型封裝結構之機械與熱特性分析”, 中華民國力學學會年會暨第四十五屆全國力學會議 (on-line), 2021.
7. 劉裕豪、賴品澤、劉柏呈、施孟鎧, “電子封裝界面結合強度量測與脫層損傷分析”, 中國機械工程學會第38屆全國學術研討會 (國立成功大學), 2021.
8. 施孟鎧、陳宣予、陳道隆, “數位影像關係法(DIC)應用於電子封裝之變形分析”, 中華民國力學學會年會暨第四十四屆全國力學會議 (宜蘭大學), 2020.
9. 施孟鎧、劉裕豪, “覆晶封裝在熱-固耦合循環測試下之應力分析”, 中國機械工程學會第37屆全國學術研討會 (虎科大), 2020.
10. Chiu, Tz-Cheng; Wu, Ji-Yen; Liu, Wei-Te; Liu, Chang-Wei; Chen, Dao-Long; Shih, MengKai; Tarng, David, “A Mechanics Model for the Moisture Induced Delamination in Fan-Out Wafer-Level Package,” IEEE 70th Electronic Components and Technology Conference (ECTC), USA, 2020.
11. Hu, Ian; Huang, Hung-Hsien; Huang, Po-Cheng; Yu, Jui-Cheng; Liao, Chien-Neng; Shih, Meng-Kai; Tamg, David; Hung, C.P., “Development of Ultra-Thin Thermal Ground Plane with High Performance Electroplated Wick,” 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm, USA, 2020.
12. Dao-Long Chen; Ian Hu; KarenYU Chen; Meng-Kai Shih; David Tarng; Dinos Huang; JY On, “Material and Structure Design Optimization for Panel-Level Fan-Out Packaging,” IEEE 69th Electronic Components and Technology Conference (ECTC), p 1710-1715, 2019.
2. Shi-Jie Chen, Yi-Hao Chen, Meng-kai Shih, I-Hung Lin, Bai-Yao Lou and Tom Ni, “Thermal Cycling Reliability Analysis of Copper Pillar Bumps in Advanced Fan-Out Packaging,” International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, Taiwan, 2023.
3. Meng-Kai Shih, Yu-Hao Liu, Guan-Sian Lin, Eddie Hsu and Jonny Yang, “Electronic Packaging Interfacial Strength Measurement and Delamination Investigation,” International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 2023.
4. 施孟鎧、賴威宏、陳宣予、陳道隆, “2.5D IC與FOCoS先進封裝結構之機械與熱特性分析”, 中華民國力學學會年會暨第四十六屆全國力學會議 (高科大), 2022.
5. 林冠賢、徐明志、楊玉林、施孟鎧, “電子封裝界面強度與濕-熱耦合脫層損傷分析”, 中國機械工程學會第39屆全國學術研討會 (聯合大學), 2022.
6. 施孟鎧、陳燦賢、陳道隆, “先進扇出型封裝結構之機械與熱特性分析”, 中華民國力學學會年會暨第四十五屆全國力學會議 (on-line), 2021.
7. 劉裕豪、賴品澤、劉柏呈、施孟鎧, “電子封裝界面結合強度量測與脫層損傷分析”, 中國機械工程學會第38屆全國學術研討會 (國立成功大學), 2021.
8. 施孟鎧、陳宣予、陳道隆, “數位影像關係法(DIC)應用於電子封裝之變形分析”, 中華民國力學學會年會暨第四十四屆全國力學會議 (宜蘭大學), 2020.
9. 施孟鎧、劉裕豪, “覆晶封裝在熱-固耦合循環測試下之應力分析”, 中國機械工程學會第37屆全國學術研討會 (虎科大), 2020.
10. Chiu, Tz-Cheng; Wu, Ji-Yen; Liu, Wei-Te; Liu, Chang-Wei; Chen, Dao-Long; Shih, MengKai; Tarng, David, “A Mechanics Model for the Moisture Induced Delamination in Fan-Out Wafer-Level Package,” IEEE 70th Electronic Components and Technology Conference (ECTC), USA, 2020.
11. Hu, Ian; Huang, Hung-Hsien; Huang, Po-Cheng; Yu, Jui-Cheng; Liao, Chien-Neng; Shih, Meng-Kai; Tamg, David; Hung, C.P., “Development of Ultra-Thin Thermal Ground Plane with High Performance Electroplated Wick,” 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm, USA, 2020.
12. Dao-Long Chen; Ian Hu; KarenYU Chen; Meng-Kai Shih; David Tarng; Dinos Huang; JY On, “Material and Structure Design Optimization for Panel-Level Fan-Out Packaging,” IEEE 69th Electronic Components and Technology Conference (ECTC), p 1710-1715, 2019.
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