1. Meng-Kai Shih, Guan-Sian Lin and Jonny Yang, “Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging,” Journal of Electronic Packaging, Transactions of the ASME, 146(3): 031002, 2024.
2. Meng-Kai Shih, Yu-Hao Liu, Guan-Sian Lin, Eddie Hsu and Jonny Yang, “Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages,” Experimental Techniques, Vol. 48, pp. 599–609, 2024.
3. Meng-Kai Shih, Yu-Hao Liu, Calvin Lee and C. P. Hung, “Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions,” Materials, 16(12), 4291, June 2023.
4. Meng-Kai Shih, Nan-Yi Wu, Wei-Hong Lai, Tang-Yuan Chen, Chin-Li Kao, C. P. Hung, “Board-Level Drop Impact Reliability Analysis of Dual-Side Molding System-in-Package (SiP) Modules,” IEEE Transactions on Electron Devices, Volume 70, Issue 1, p 215-221, Jan. 2023.
5. Han-Wen Hu, Yu-Wei Huang, Yi-Chieh Tsai, Meng-Kai Shih, Kuan-Neng Chen, “Hybrid Soldering 2.3D Assembly with High Reliability and Low Cost,” IEEE Journal of the Electron Devices Society, v 10, p 791-796, September 2022.
6. Meng-Kai Shih, Yu-Wei Huang, Guan-Sian Lin, “Next-Generation High-Density PCB Development by Fan-Out RDL Technology,” IEEE Transactions on Device and Materials Reliability, Volume 22, Issue 2, p 296-305, June 2022.
7. Meng-Kai Shih, Sean Shih, Tse-Wei Liao, Dao-Long Chen, D.S. Liu, David Tarng, “Investigation into thermo-mechanical reliability of copper trace lines in stacked dies ball grid array packaging,” Microelectronics Reliability, Volume 130, March 2022.
8. Meng-kai Shih, Wei-hong Lai, Tse-wei Liao, Karen Chen, Dao-Long Chen, C. P. Hung, “Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages,” IEEE Transactions on Components Packaging and Manufacturing Technology, v 12, n 2, p 297-305, Feb. 2022.
9. Mengkai Shih, Tai-Kuang Lee and Jin-Gyao Chang, “Warpage modeling and characterization of intelligent power modules (IPMs),” Journal of Mechanics, v 37, p 543-550, Sep. 2021.
10. Mengkai Shih, Karen Chen, Teck Lee, David Tarng, CP Hung, “FE simulation model for warpage evaluation of glass interposer substrate packages,” IEEE Transactions on Components, Packaging and Manufacturing Technology, v 11, n 4, p 690-696, 2021.
11. Ming-Yi Tsai, Jia-Hao Yeh, Pu-Shan Huang, D. L. Chen, M. K. Shih and David Tarng, “Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the PoEF Test,” IEEE Transactions on Device and Materials Reliability, v 20, n 2, p 442-451, 2020.
12. Meng-Kai Shih, Chih-Yi Huang, Tsan-Hsien Chen, Chen-Chao Wang, David Tarng and CP Hung, “Electrical Thermal and Mechanical Characterization of eWLB, Fully-Molded Fan-Out Package and Fan-Out Chip Last Package,” IEEE Transactions on Components, Packaging and Manufacturing Technology, v 9, n 9, p 1765-1775, 2019.
13. M. Y. Tsai, P. S. Huang, J. H. Yeh, H. Y. Liu, Y. C. Chao, Fila Tsai, D. L. Chen, M. K. Shih and David Tarng, “Evaluation of Three-Point Bending Strength of Thin Silicon Die with a Consideration of Geometric Nonlinearity,” IEEE Transactions on Device and Materials Reliability, v 19, n 4, p 615-621, 2019.